Rentai Technology Achieves Breakthrough in 2.5D Packaging Technology R&D

Rentai Technology's packaging technology laboratory has recently achieved a major breakthrough in 2.5D packaging technology, successfully developing a 2.5D packaging solution based on silicon interposers. By integrating multiple chips horizontally, this technology significantly improves the communication bandwidth and energy efficiency between chips.

Test data shows that AI chips using 2.5D packaging technology achieve a 30% performance improvement and a 25% reduction in power consumption. The interconnect density between chips reaches five times that of traditional packaging technologies, and signal transmission latency is reduced by 60%.

This technological breakthrough provides a new solution for application scenarios that require large-scale parallel computing, such as high-performance computing and artificial intelligence. Rentai Technology plans to be the first to apply this packaging technology in its next-generation AI training chips.

The maturity of 2.5D packaging technology will drive chip integration to a higher level and provide a new technical path for extending Moore's Law.